Founded in 2019 and based in Foshan Nanhai, Plutosemi Co., Ltd. specializes in high-performance semiconductor materials. As an industry leader, we offer advanced production capabilities and high-quality products such as silicon wafers and SOI, featuring high precision for diverse applications. Our one-stop services and customized solutions meet specific customer needs. Widely used in China, Europe, and the USA, we maintain strong partnerships with renowned international companies, upholding the philosophy of "Customer First, Quality Foremost".
The company maintains industry-leading standards with certifications in high-performance semiconductor materials R&D, production, and sales, supporting its position as a leader in the semiconductor materials sector.
Glass wafers have become an essential substrate and support material in today’s semiconductor manufacturing, especially as devices move toward higher precision, advanced packaging, and miniaturized architectures. Their stability, transparency, and compatibility with MEMS, optical components, and heterogeneous integration make them increasingly valuable in fabrication lines.
Through-silicon via, commonly called TSV, is a vertical electrical connection that passes completely through a silicon wafer or die. It has become a foundational technology for advanced semiconductor packaging, allowing multiple chips to be stacked in a compact structure with shorter signal paths and reduced power loss.
Glass wafers have become an important substrate option in advanced electronics, optical systems, MEMS, and semiconductor packaging. While silicon wafers remain dominant in traditional integrated circuits, glass offers structural, optical, and electrical benefits that fit the needs of next-generation devices.
