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High Precision Alumina Ceramic Substrate

High Precision Alumina Ceramic Substrate

Ceramic Wafers

Alumina ceramic(Al2O3) wafer has lots of advantages, it has good thermal conductivity, stable insulation, thermal shock resistance, wear resistance, Anti-acid and Anti-alkali etc.
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Products Description

alumina ceramic substrate (Al2O3) offers exceptional properties that make it indispensable across various applications. Renowned for its superior thermal conductivity, stable insulation, wear resistance, thermal shock resistance, and chemical resistance, it is widely used in thick film hybrid integrated circuits, HTC, LED ceramic heat sinks, power modules, and semiconductor devices. Despite its moderate thermal conductivity (20W/m·K), Al2O3 ceramic is the most popular substrate due to its cost-effectiveness, simple production process, and reliable performance. The 96% alumina ceramic substrate excels in wear resistance, high-temperature insulation, and chemical stability, while the 99.6% variant offers enhanced thermal conductivity (28W/m·K), making it a premium choice for high-performance heat sinks. As a leading China alumina ceramic substrate manufacturer, our alumina substrates combine cutting-edge technology with unmatched durability, offering optimal performance in a variety of industrial applications.


High Precision Alumina Ceramic Substrate


Application:

1. Thick film hybrid integrated circuit (HIC), mainly used in automotive and communication thick film circuits (communication, automotive).

2. Mold stamping sheet: It is mainly used for wafer for crystal oscillator, potentiometer, refrigerator and various types of shaped wafers, military and medical wafers.

3. Laser perforated sheet.

4. Wafer for printer and semiconductor equipment: The largest size printer wafer we can provide is 380mm*100mm and the thickness is between 0.38-1.2.


Product Standard:

Product NamePurity / MethodSizeThicknessPolishing
Alumina Ceramic substrate96%
99%
99.7%
114.3 x 114.3mm
101.6 x 101.6mm
100 x 100mm
76.2 x 76.2mm
50 x 50mm
10 x 10mm
φ50.8mm
φ100mm
Or others
0.1mm
0.25mm
0.385mm
0.5mm
0.635mm
1.0mm
2.0mm
Or others
Un-polished surface
Single side polished
Double side polished

Unpolished: Ra 0.2~0.75um
Polished: Ra 0.02~0.05um
Best Polished: Ra<10nm

High Precision Alumina Ceramic Substrate Specifications

Substrate materialAlumina ceramic plate / substrate
PurityAlumina(Al2O3) 96%, 99% and 99.7%
Density (g/cm3)> 3.75
Thermal conductivity (w/m.k)> 24
Thermal expansion (x10 -6 / ℃)6.5~7.5(20~300℃)
6.5~8.0(300~800℃)
Dielectric Strength (Kv/mm)> 17
Dielectric Constant (at 1MHZ)9~10
Loss tangent (x10 -4 @1MHZ)4
Flexural strength (N/mm2 )> 350 Mpa
Water absorption0%

Application Scenarios

Semiconductor silicon wafer is the upstream of integrated circuit industry and is an important material for manufacturing integrated circuits.


Semiconductor silicon wafer manufacturing technology is difficult, the downstream application is wide, the market value is high, is the main application field of silicon wafer. Silicon is the starting point of the semiconductor industry chain, through the front and back of the entire chip manufacturing process, without silicon semiconductor industry will be like water without a source. The output and quality of silicon wafers directly restricts the entire semiconductor industry, and the development of many industries such as communications, automobiles, and computers further downstream, and is a key material for manufacturing chips.


Semiconductor products are mainly used in computer, household appliances, digital electronics, electrical, communications, transportation, medical, aerospace and many other fields.


Application Scenarios

Packaging and Transportation

The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.

We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed. 

We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection. 

Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.

We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.


Packaging and Transportation

Enterprise Strength

Factory Area: 3000 sq


Process:

1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation


Capacity:

Glass Wafer --- 30K pcs 

Silicon Wafer --- 20K pcs 

(Equal to 6in) 


Enterprise Strength

Quality Assurance

Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.


Warranty period: In accordance with the contract requirements.


Quality system management:

●Organize production according to ISO9001 and other quality system standards.

Quality management system and measures:

●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.

●Strengthen the quality inspection system, strengthen the process quality control

●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.

●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.


Quality control in the production stage:

●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.

●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.

●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.


Quality Assurance

Pre-sales and After-sales

Pre-sales Service

Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.


On-purchase Service

Produce products according to the confirmed specifications and our process.


After Sale Service

We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.


About Us PLUTOSEMI

Plutosemi Co., Ltd.  was established in 2019, headquartered in Nanhai, Foshan, focusing on the research and development, production, and sales of high-performance semiconductor materials. 

Advanced production capacity: We have three major production bases in China, with a monthly production capacity of 100000 equivalent 6-inch silicon wafers and 30000 equivalent 8-inch glass wafers, ensuring stable and efficient product supply for our customers.

High quality products: We provide efficient and stable product supply innovative solutions in the fields of glass wafers, silicon polishing wafers, epitaxial wafers (EPI), silicon on insulator wafers (SOI), and more. Our silicon wafers have the characteristics of ultra-thin, ultraflat, and high-precision, which can meet the needs of various high-end applications. Our glass and quartz substrates are also renowned for their high smoothness and precise aperture design.

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