Gallium nitride, GaN substrate. GaN has a wide direct bandgap, strong atomic bonds and high thermal conductivity, etc., and it is a strong ability on anti-radiation, not only is the short-wavelength optoelectronic materials, also the replacement materials of high temperature semiconductor device. GaN can be used to make blue and green LED, or violet, ultraviolet light LD, ultraviolet detectors and high-frequency high-power electronic devices.

gallium nitride substrate is renowned for their exceptional properties, including a wide direct bandgap, strong atomic bonds, and high thermal conductivity. These characteristics make GaN an ideal material for a variety of advanced applications. It is particularly effective in resisting radiation, making it suitable for harsh environments. GaN substrates are widely used in the production of blue, green, and violet LEDs, as well as ultraviolet light-emitting diodes (LEDs), ultraviolet detectors, and high-frequency, high-power electronic devices. Additionally, GaN serves as an excellent replacement material for high-temperature semiconductor devices due to its superior thermal performance and robustness. As a leading China gallium nitride substrate supplier, we provide high-quality GaN substrates for a wide range of applications in the optoelectronics and semiconductor industries.

1. Wide Bandgap: GaN has a wide direct bandgap of approximately 3.4 eV, which allows it to operate efficiently at high voltages, temperatures, and frequencies, making it ideal for high-performance applications.

2. High Thermal Conductivity: GaN substrates offer superior heat dissipation, which is crucial for high-power devices. This property ensures better thermal management, reducing the risk of overheating in electronic components.

3. Radiation Resistance: GaN is highly resistant to radiation, which makes it suitable for use in space applications, high-energy physics experiments, and other environments exposed to radiation.

4. Mechanical Strength: GaN has strong atomic bonds, providing excellent mechanical strength and durability. This makes GaN substrates suitable for harsh operational conditions.

5. Optoelectronic Applications: GaN is widely used in the production of blue, green, and violet LEDs, as well as ultraviolet light-emitting diodes (LEDs), offering high luminous efficiency and long lifespan.

Semiconductor silicon wafer is the upstream of integrated circuit industry and is an important material for manufacturing integrated circuits.

Semiconductor silicon wafer manufacturing technology is difficult, the downstream application is wide, the market value is high, is the main application field of silicon wafer. Silicon is the starting point of the semiconductor industry chain, through the front and back of the entire chip manufacturing process, without silicon semiconductor industry will be like water without a source. The output and quality of silicon wafers directly restricts the entire semiconductor industry, and the development of many industries such as communications, automobiles, and computers further downstream, and is a key material for manufacturing chips.

Semiconductor products are mainly used in computer, household appliances, digital electronics, electrical, communications, transportation, medical, aerospace and many other fields.

The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.

We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed. 

We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection. 

Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.

We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.

Factory Area: 3000 sq

Process:

1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation

Capacity:

Glass Wafer --- 30K pcs 

Silicon Wafer --- 20K pcs 

(Equal to 6in) 

Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.

Warranty period: In accordance with the contract requirements.

Quality system management：

●Organize production according to ISO9001 and other quality system standards.

Quality management system and measures:

●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.

●Strengthen the quality inspection system, strengthen the process quality control

●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.

●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.

Quality control in the production stage:

●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.

●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.

●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.

Pre-sales Service

Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.

On-purchase Service

Produce products according to the confirmed specifications and our process.

After Sale Service

We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.