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HomeProducts Compound Semiconductor Wafers Polished Indium Arsenide Wafer
Polished Indium Arsenide Wafer

Polished Indium Arsenide Wafer

Compound Semiconductor Wafers

Indium arsenide(InAs) or indium monoarsenide is a semiconductor composed of indium and arsenic. It has the appearance of a grey cubic crystal with a melting point of 942°C. Indium arsenide is used to construct infrared detectors in the wavelength range of 1-3.8 μm.The detectors are usually photovoltaic photodiodes.
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Products Description

Polished Indium Arsenide Wafer is high-quality semiconductor material used in a variety of advanced electronic and optoelectronic applications. With exceptional electron mobility and a narrow band gap, these wafers are crucial in the development of infrared detectors, photodiodes, and diode lasers. InAs wafers are ideal for high-power applications at room temperature or cryogenic conditions, especially in the 1-3.8 μm infrared wavelength range. Their polished surfaces ensure minimal defects, making them perfect for precision manufacturing of high-performance devices. As a leading China indium arsenide wafer supplier, we specialize in providing high-quality InAs wafers for a range of applications, our wafers are manufactured to the highest standards.


Polished Indium Arsenide Wafer

Polished Indium Arsenide Wafer Specifications

VarietyDiameter(inch)TypeConcentration(cm-3Mobility(cm²/V.s)Etch-Pit-Density(cm-2
Pure InAs2/3/4N5×1016≥2×104<5×104
Sn-InAs2/3/4N(5-20)×10177000-20000<5×104
S-InAs2/3/4N(1-10)×10176000-20000<3×104
Zn-InAs2/3/4P(1-10)×1017100-400<3×104
Wafers are polished on one side or both sides, ready to use right out of the box. Crystal direction (100), 2-inch wafer thickness 500±25μm, 3-inch wafer thickness 600±25μm, other special specifications are processed upon request.

Polished Indium Arsenide Wafer Features

1. Polished Surface: Indium Arsenide wafers are polished on one side or both sides, ensuring smooth, defect-free surfaces ideal for precision applications. These wafers are ready to use directly out of the box, eliminating the need for further surface preparation.

2. Crystal Direction: The wafers are oriented in the (100) crystal direction, which is critical for many semiconductor processes and ensures optimal performance for electronic and optoelectronic devices.

3. High-Quality Material: Manufactured with precision, these wafers exhibit excellent electrical properties, high electron mobility, and low defect density, making them ideal for infrared detectors, photodiodes, and other advanced semiconductor applications.

4. Ready for Use: With polished surfaces and accurate thickness control, these wafers are ready to be integrated into high-performance systems without the need for additional processing steps.

Application Scenarios

Semiconductor silicon wafer is the upstream of integrated circuit industry and is an important material for manufacturing integrated circuits.


Semiconductor silicon wafer manufacturing technology is difficult, the downstream application is wide, the market value is high, is the main application field of silicon wafer. Silicon is the starting point of the semiconductor industry chain, through the front and back of the entire chip manufacturing process, without silicon semiconductor industry will be like water without a source. The output and quality of silicon wafers directly restricts the entire semiconductor industry, and the development of many industries such as communications, automobiles, and computers further downstream, and is a key material for manufacturing chips.


Semiconductor products are mainly used in computer, household appliances, digital electronics, electrical, communications, transportation, medical, aerospace and many other fields.


Application Scenarios

Packaging and Transportation

The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.

We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed. 

We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection. 

Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.

We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.


Packaging and Transportation

Enterprise Strength

Factory Area: 3000 sq


Process:

1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation


Capacity:

Glass Wafer --- 30K pcs 

Silicon Wafer --- 20K pcs 

(Equal to 6in) 


Enterprise Strength

Quality Assurance

Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.


Warranty period: In accordance with the contract requirements.


Quality system management:

●Organize production according to ISO9001 and other quality system standards.

Quality management system and measures:

●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.

●Strengthen the quality inspection system, strengthen the process quality control

●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.

●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.


Quality control in the production stage:

●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.

●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.

●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.


Quality Assurance

Pre-sales and After-sales

Pre-sales Service

Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.


On-purchase Service

Produce products according to the confirmed specifications and our process.


After Sale Service

We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.


About Us PLUTOSEMI

Plutosemi Co., Ltd.  was established in 2019, headquartered in Nanhai, Foshan, focusing on the research and development, production, and sales of high-performance semiconductor materials. 

Advanced production capacity: We have three major production bases in China, with a monthly production capacity of 100000 equivalent 6-inch silicon wafers and 30000 equivalent 8-inch glass wafers, ensuring stable and efficient product supply for our customers.

High quality products: We provide efficient and stable product supply innovative solutions in the fields of glass wafers, silicon polishing wafers, epitaxial wafers (EPI), silicon on insulator wafers (SOI), and more. Our silicon wafers have the characteristics of ultra-thin, ultraflat, and high-precision, which can meet the needs of various high-end applications. Our glass and quartz substrates are also renowned for their high smoothness and precise aperture design.

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