Indium phosphide (InP) single crystal material is used as one of the most important compound semiconductor material, use to produce optical communications material of InP-based laser diode (LD), it is the key materials of Light emitting diode (LED) and photodetector. These devices realized message transmit , dissemination, amplification, reception and other functions in fiber-optic communications. InP is also very suitable for high frequency devices such as high electron mobility transistor (HEMT) and heterojunction bipolar transistor (HBT) and others.

indium phosphide wafer is a crucial material for high-performance optoelectronic devices, including InP-based laser diodes (LDs), light-emitting diodes (LEDs), and photodetectors. These wafers play a vital role in optical communication systems, enabling functions such as message transmission, amplification, and reception over fiber-optic networks. InP is also ideal for high-frequency applications, such as high electron mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs). The material's unique properties make it indispensable for next-generation telecommunication and high-speed electronics. As a leading China indium phosphide wafer supplier, we provide high-quality, precision-engineered InP wafers suitable for various advanced technologies.

1. High Optical Performance: InP wafers are ideal for optoelectronic applications such as laser diodes (LDs), light-emitting diodes (LEDs), and photodetectors, offering excellent optical efficiency and wavelength performance.

2. Superior Material for Optical Communication: They enable high-speed data transmission in fiber-optic communication systems, supporting transmission, amplification, and reception of signals.

3. High Frequency Capability: InP is well-suited for high-frequency devices, including high electron mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs), essential for advanced telecommunications and RF applications.

4. Exceptional Electrical Properties: InP has excellent electron mobility and low noise characteristics, making it ideal for high-performance electronics and high-frequency integrated circuits.

Semiconductor silicon wafer is the upstream of integrated circuit industry and is an important material for manufacturing integrated circuits.

Semiconductor silicon wafer manufacturing technology is difficult, the downstream application is wide, the market value is high, is the main application field of silicon wafer. Silicon is the starting point of the semiconductor industry chain, through the front and back of the entire chip manufacturing process, without silicon semiconductor industry will be like water without a source. The output and quality of silicon wafers directly restricts the entire semiconductor industry, and the development of many industries such as communications, automobiles, and computers further downstream, and is a key material for manufacturing chips.

Semiconductor products are mainly used in computer, household appliances, digital electronics, electrical, communications, transportation, medical, aerospace and many other fields.

The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.

We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed. 

We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection. 

Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.

We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.

Factory Area: 3000 sq

Process:

1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation

Capacity:

Glass Wafer --- 30K pcs 

Silicon Wafer --- 20K pcs 

(Equal to 6in) 

Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.

Warranty period: In accordance with the contract requirements.

Quality system management：

●Organize production according to ISO9001 and other quality system standards.

Quality management system and measures:

●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.

●Strengthen the quality inspection system, strengthen the process quality control

●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.

●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.

Quality control in the production stage:

●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.

●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.

●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.

Pre-sales Service

Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.

On-purchase Service

Produce products according to the confirmed specifications and our process.

After Sale Service

We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.