
Polished Lithium Tantalate Wafer
Compound Semiconductor Wafers

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sales@plutosemitech.com Email
Lithium tantalate (LiTaO3) crystal is an excellent multifunctional material with high application value. LiTaO3 crystal has become the best choice of pyroelectric infrared detector materials due to its stable and high chemical properties (insoluble and water), curie point higher than 600℃, not easy to depolarization phenomenon, low dielectric loss, and high optimal detection rate. The polished lithium tantalate wafer is widely used in the manufacture of resonators, filters, transducers and other electronic communication devices, especially because of its good mechanical and electrical coupling, temperature coefficient and other comprehensive performance, it is used in the manufacture of high-frequency surface acoustic wave devices, and in many high-end communication fields such as mobile phones, walkie-talkies, satellite communications, aerospace and so on. As demand for these high-performance materials grows, sourcing China lithium tantalate wafer wholesale has become a key strategy for industries requiring reliable and efficient components for high-end electronic systems.
Polished Lithium Tantalate Wafer Specifications
Fe doped LT Wafers
Parameter | Specification |
Material | LiTaO3 wafers(White or Black &Fe doped) |
Diameter | 3inch/4inch/6inch |
Diameter Tolerance | ±0.03mm |
Curie Temp | 603±2℃ |
Cutting Angle | X/Y/Z/X112Y/Y36/Y42/Y48/etc |
Tol(±) | < 0.20 mm |
Thickness | 0.18 ~ 0.5mm or more |
Primary Flat | 22mm /32mm /42.5mm /57.5mm |
LTV (5mmx5mm) | < 1μm |
TTV | < 3μm |
BOW | -30 |
WARP | < 40μm |
PLTV(<0.5um)<> | ≥95%(5mm*5mm) |
Orientation Flat | All available |
Surface Type | Single Side Polished(SSP) /Double Sides Polished(DSP) |
Polished side Ra | < 0.5nm |
Back Side Criteria | General is 0.2-0.5μm or as customized |
Edge Criteria | R=0.2mm or Bullnose |
Fe doped | Fe doped for saw grade LN < wafers |
Wafer Surface Criteria | Transmissivity general: 5.9x10-11 < s <2.0*10-11 |
Contamination None | |
Particles @>0.3 μm ≤30 | |
Scratch, Chipping None | |
Defect No edge cracks, scratches, saw marks, stains | |
Packing | 25pcs per box |
Optical Grade Lithium Tantalate Wafers
Parameter | Specification |
Material | LiTaO3 wafers(White or Black) |
Diameter | 2inch/3inch/4inch |
Diameter Tolerance | ±0.03mm |
Curie Temp | 603±2℃ |
Cutting Angle | X/Y/Z etc. |
Tol(±) | < 0.20 mm |
Thickness | 0.18 ~ 0.5mm or more |
Primary Flat | 16mm/22mm /32mm |
TTV | < 3μm |
BOW | -30 |
WARP | < 40μm |
Surface Type | Single Side Polished(SSP) /Double Sides Polished(DSP) |
Polished side Ra | < 0.5nm |
Back Side Criteria | General is 0.2-0.5μm or as customized |
Edge Criteria | R=0.2mm or Bullnose |
Optical doped | Zn/MgO etc. |
Wafer Surface Criteria | Contamination None |
Particles @>0.3 μm ≤30 | |
Scratch, Chipping None | |
Defect No edge cracks, scratches, saw marks, stains | |
Packing | 25pcs per box |
SAW Grade Lithium Tantalate Wafers
Parameter | Specification |
Material | LiTaO3 wafers |
Diameter | 3inch/4inch/6inch |
Diameter Tolerance | ±0.03mm |
Curie Temp | 603±2℃ |
Cutting Angle | X/Y/Z/X112Y/Y36/Y42/Y48/etc. |
Tol(±) | < 0.20 mm |
Thickness | 0.18 ~ 0.5mm or more |
Primary Flat | 22mm /32mm /42.5mm /57.5mm |
LTV (5mmx5mm) | < 1μm |
TTV | <3μm |
BOW | -30 < bow < 30 |
WARP | < 40μm |
PLTV(<0.5um)<> | ≥95%(5mm*5mm) |
Orientation Flat | All available |
Surface Type | Single Side Polished(SSP) /Double Sides Polished(DSP) |
Polished side Ra | < 0.5nm |
Back Side Criteria | General is 0.2-0.5μm or as customized |
Edge Criteria | R=0.2mm or Bullnose |
Wafer Surface Criteria | Transmissivity general:5.9x10-11 < s < 2.0*10- |
Contamination None | |
Particles @>0.3 μm ≤30 | |
Scratch , Chipping None | |
Defect No edge cracks, scratches, saw marks, stains | |
Packing | 25pcs per box |
Polished Lithium Tantalate Wafer Features
1. High Curie Temperature: Lithium tantalate has a high Curie point (above 600℃), making it stable even under extreme thermal conditions, which enhances its performance in high-temperature applications.
2. Pyroelectric Properties: It exhibits excellent pyroelectric characteristics, which is why it is widely used in infrared detectors and thermal sensors. Its high sensitivity to temperature changes makes it ideal for thermal detection applications.
3. Low Dielectric Loss: The wafer material has low dielectric loss, ensuring efficient signal transmission and minimal energy waste in electronic devices, especially in high-frequency applications.
4. Stable Chemical Properties: LiTaO3 is chemically stable, insoluble in water, and resistant to most acids and bases. This makes it durable and reliable in a variety of harsh environments.
5. Good Mechanical and Electrical Coupling: The material offers strong mechanical and electrical coupling, which enhances the performance of devices such as resonators and transducers.
Application Scenarios
Semiconductor silicon wafer is the upstream of integrated circuit industry and is an important material for manufacturing integrated circuits.
Semiconductor silicon wafer manufacturing technology is difficult, the downstream application is wide, the market value is high, is the main application field of silicon wafer. Silicon is the starting point of the semiconductor industry chain, through the front and back of the entire chip manufacturing process, without silicon semiconductor industry will be like water without a source. The output and quality of silicon wafers directly restricts the entire semiconductor industry, and the development of many industries such as communications, automobiles, and computers further downstream, and is a key material for manufacturing chips.
Semiconductor products are mainly used in computer, household appliances, digital electronics, electrical, communications, transportation, medical, aerospace and many other fields.
Packaging and Transportation
The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.
We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed.
We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection.
Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.
We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.
Enterprise Strength
Factory Area: 3000 sq
Process:
1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation
Capacity:
Glass Wafer --- 30K pcs
Silicon Wafer --- 20K pcs
(Equal to 6in)
Quality Assurance
Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.
Warranty period: In accordance with the contract requirements.
Quality system management:
●Organize production according to ISO9001 and other quality system standards.
Quality management system and measures:
●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.
●Strengthen the quality inspection system, strengthen the process quality control
●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.
●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.
Quality control in the production stage:
●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.
●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.
●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.
Pre-sales and After-sales
Pre-sales Service
Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.
On-purchase Service
Produce products according to the confirmed specifications and our process.
After Sale Service
We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.
Plutosemi Co., Ltd. was established in 2019, headquartered in Nanhai, Foshan, focusing on the research and development, production, and sales of high-performance semiconductor materials.
Advanced production capacity: We have three major production bases in China, with a monthly production capacity of 100000 equivalent 6-inch silicon wafers and 30000 equivalent 8-inch glass wafers, ensuring stable and efficient product supply for our customers.
High quality products: We provide efficient and stable product supply innovative solutions in the fields of glass wafers, silicon polishing wafers, epitaxial wafers (EPI), silicon on insulator wafers (SOI), and more. Our silicon wafers have the characteristics of ultra-thin, ultraflat, and high-precision, which can meet the needs of various high-end applications. Our glass and quartz substrates are also renowned for their high smoothness and precise aperture design.