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HomeProducts Compound Semiconductor Wafers Polished Lithium Tantalate Wafer
Polished Lithium Tantalate Wafer

Polished Lithium Tantalate Wafer

Compound Semiconductor Wafers

Lithium tantalate (LiTaO3) crystal is an excellent multifunctional material with high application value. LiTaO3 crystal has become the best choice of pyroelectric infrared detector materials due to its stable and high chemical properties (insoluble and water), curie point higher than 600℃, not easy to depolarization phenomenon, low dielectric loss, and high optimal detection rate.
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Products Description

Lithium tantalate (LiTaO3) crystal is an excellent multifunctional material with high application value. LiTaO3 crystal has become the best choice of pyroelectric infrared detector materials due to its stable and high chemical properties (insoluble and water), curie point higher than 600℃, not easy to depolarization phenomenon, low dielectric loss, and high optimal detection rate. The polished lithium tantalate wafer is widely used in the manufacture of resonators, filters, transducers and other electronic communication devices, especially because of its good mechanical and electrical coupling, temperature coefficient and other comprehensive performance, it is used in the manufacture of high-frequency surface acoustic wave devices, and in many high-end communication fields such as mobile phones, walkie-talkies, satellite communications, aerospace and so on. As demand for these high-performance materials grows, sourcing China lithium tantalate wafer wholesale has become a key strategy for industries requiring reliable and efficient components for high-end electronic systems.


Polished Lithium Tantalate Wafer

Polished Lithium Tantalate Wafer Specifications

Fe doped LT Wafers

ParameterSpecification
MaterialLiTaO3 wafers(White or Black &Fe doped)
Diameter3inch/4inch/6inch
Diameter Tolerance±0.03mm
Curie Temp603±2℃
Cutting AngleX/Y/Z/X112Y/Y36/Y42/Y48/etc
Tol(±)< 0.20 mm
Thickness0.18 ~ 0.5mm or more
Primary Flat22mm /32mm /42.5mm /57.5mm
LTV (5mmx5mm)< 1μm
TTV< 3μm
BOW-30
WARP< 40μm
PLTV(<0.5um)<>≥95%(5mm*5mm)
Orientation FlatAll available
Surface TypeSingle Side Polished(SSP) /Double Sides Polished(DSP)
Polished side Ra< 0.5nm
Back Side CriteriaGeneral is 0.2-0.5μm or as customized
Edge CriteriaR=0.2mm or Bullnose
Fe dopedFe doped for saw grade LN < wafers
Wafer Surface CriteriaTransmissivity general: 5.9x10-11 < s <2.0*10-11-10 at 25℃
Contamination None
Particles @>0.3 μm ≤30
Scratch, Chipping None
Defect No edge cracks, scratches, saw marks, stains
Packing25pcs per box


Optical Grade Lithium Tantalate Wafers

ParameterSpecification
MaterialLiTaO3 wafers(White or Black)
Diameter2inch/3inch/4inch
Diameter Tolerance±0.03mm
Curie Temp603±2℃
Cutting AngleX/Y/Z etc.
Tol(±)< 0.20 mm
Thickness0.18 ~ 0.5mm or more
Primary Flat16mm/22mm /32mm
TTV< 3μm
BOW-30
WARP< 40μm
Surface TypeSingle Side Polished(SSP) /Double Sides   Polished(DSP)
Polished side Ra< 0.5nm
Back Side CriteriaGeneral is 0.2-0.5μm or as customized
Edge CriteriaR=0.2mm or Bullnose
Optical dopedZn/MgO etc.
Wafer Surface CriteriaContamination  None
Particles @>0.3 μm  ≤30
Scratch, Chipping None
Defect No edge cracks, scratches, saw marks, stains
Packing25pcs per box

SAW Grade Lithium Tantalate Wafers

ParameterSpecification
MaterialLiTaO3 wafers
Diameter3inch/4inch/6inch
Diameter Tolerance±0.03mm
Curie Temp603±2℃
Cutting AngleX/Y/Z/X112Y/Y36/Y42/Y48/etc.
Tol(±)< 0.20 mm
Thickness0.18 ~ 0.5mm or more
Primary Flat22mm /32mm /42.5mm /57.5mm
LTV (5mmx5mm)< 1μm 
TTV <3μm
BOW-30 < bow < 30
WARP< 40μm
PLTV(<0.5um)<>≥95%(5mm*5mm)
Orientation FlatAll available
Surface TypeSingle Side Polished(SSP) /Double Sides Polished(DSP)
Polished side Ra< 0.5nm
Back Side CriteriaGeneral is 0.2-0.5μm or as customized
Edge CriteriaR=0.2mm or Bullnose
Wafer Surface CriteriaTransmissivity   general:5.9x10-11 < s < 2.0*10-10 at 25℃< /s < 2.0*10
Contamination       None
Particles @>0.3 μm  ≤30
Scratch , Chipping   None
Defect              No edge cracks, scratches, saw marks, stains
Packing25pcs per box

Polished Lithium Tantalate Wafer Features

1. High Curie Temperature: Lithium tantalate has a high Curie point (above 600℃), making it stable even under extreme thermal conditions, which enhances its performance in high-temperature applications.

2. Pyroelectric Properties: It exhibits excellent pyroelectric characteristics, which is why it is widely used in infrared detectors and thermal sensors. Its high sensitivity to temperature changes makes it ideal for thermal detection applications.

3. Low Dielectric Loss: The wafer material has low dielectric loss, ensuring efficient signal transmission and minimal energy waste in electronic devices, especially in high-frequency applications.

4. Stable Chemical Properties: LiTaO3 is chemically stable, insoluble in water, and resistant to most acids and bases. This makes it durable and reliable in a variety of harsh environments.

5. Good Mechanical and Electrical Coupling: The material offers strong mechanical and electrical coupling, which enhances the performance of devices such as resonators and transducers.

Application Scenarios

Semiconductor silicon wafer is the upstream of integrated circuit industry and is an important material for manufacturing integrated circuits.


Semiconductor silicon wafer manufacturing technology is difficult, the downstream application is wide, the market value is high, is the main application field of silicon wafer. Silicon is the starting point of the semiconductor industry chain, through the front and back of the entire chip manufacturing process, without silicon semiconductor industry will be like water without a source. The output and quality of silicon wafers directly restricts the entire semiconductor industry, and the development of many industries such as communications, automobiles, and computers further downstream, and is a key material for manufacturing chips.


Semiconductor products are mainly used in computer, household appliances, digital electronics, electrical, communications, transportation, medical, aerospace and many other fields.


Application Scenarios

Packaging and Transportation

The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.

We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed. 

We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection. 

Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.

We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.


Packaging and Transportation

Enterprise Strength

Factory Area: 3000 sq


Process:

1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation


Capacity:

Glass Wafer --- 30K pcs 

Silicon Wafer --- 20K pcs 

(Equal to 6in) 


Enterprise Strength

Quality Assurance

Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.


Warranty period: In accordance with the contract requirements.


Quality system management:

●Organize production according to ISO9001 and other quality system standards.

Quality management system and measures:

●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.

●Strengthen the quality inspection system, strengthen the process quality control

●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.

●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.


Quality control in the production stage:

●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.

●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.

●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.


Quality Assurance

Pre-sales and After-sales

Pre-sales Service

Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.


On-purchase Service

Produce products according to the confirmed specifications and our process.


After Sale Service

We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.


About Us PLUTOSEMI

Plutosemi Co., Ltd.  was established in 2019, headquartered in Nanhai, Foshan, focusing on the research and development, production, and sales of high-performance semiconductor materials. 

Advanced production capacity: We have three major production bases in China, with a monthly production capacity of 100000 equivalent 6-inch silicon wafers and 30000 equivalent 8-inch glass wafers, ensuring stable and efficient product supply for our customers.

High quality products: We provide efficient and stable product supply innovative solutions in the fields of glass wafers, silicon polishing wafers, epitaxial wafers (EPI), silicon on insulator wafers (SOI), and more. Our silicon wafers have the characteristics of ultra-thin, ultraflat, and high-precision, which can meet the needs of various high-end applications. Our glass and quartz substrates are also renowned for their high smoothness and precise aperture design.

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