SiC Silicon Carbide Wafer
Compound Semiconductor Wafers
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+86-17701852595 WhatsApp
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sales@plutosemitech.com Email
silicon carbide wafer is advanced semiconductor materials widely used in high-power, high-frequency, and high-temperature applications. Known for their superior thermal conductivity, high electric field breakdown strength, and excellent resistance to corrosion, SiC wafers are ideal for power electronics, automotive, and industrial applications. These wafers are critical in the development of energy-efficient devices, as they enable faster switching speeds and higher voltage handling capabilities compared to traditional silicon-based materials. With high durability and reliability, SiC wafers are key to supporting next-generation technologies in areas like electric vehicles, renewable energy, and telecommunications. As a leading China silicon carbide wafer manufacturer, we provide top-quality SiC wafers that meet international standards and are tailored to a wide range of customer needs.
SiC Silicon Carbide Wafer Specifications
| Diameter | 150±0.5mm, 200±0.25 mm | ||
| Thickness 4H | 350 μm±25μm | ||
| 500 μm±25μm | |||
| Wafer Orientation | Off axis : 4.0° toward 1120 ±0.5° | ||
| Micropipe Density | ≤ 0.2 cm-2 | ≤ 5 cm-2 | ≤ 10 cm-2 |
| BPD | ≤ 1500ea/cm2 | ≤ 2000ea/cm2 | NA |
| TSD | ≤ 300ea/cm2 | ≤ 1000ea/cm2 | NA |
| Resistivity | 0.015~0.025 Ω·cm | ||
| Edge exclusion | 3 mm | ||
| TTV/Bow /Warp | ≤ 3μm / ≤ 5μm / ≤ 10μm | ||
| Roughness | Polish Ra ≤ 0.2 nm | ||
| Cracks by high intensity light | None | None | 1 allowed, ≤ 1 mm |
| Hex Plates by high intensity light | Cumulative area≤ 1 % | Cumulative area≤ 1 % | Cumulative area≤ 3 % |
| Polytype Areas by high intensity light | None | Cumulative area≤ 2 % | Cumulative area≤ 5% |
| Scratches by | 3 scratches to 1× | 5 scratches to 1× | 8 scratches to 1× |
| high intensity light | wafer diameter | wafer diameter | wafer diameter |
| cumulative length | cumulative length | cumulative length | |
| Edge chip | None | 3 allowed, ≤ 0.5 mm each | 5 allowed, ≤ 1 mm each |
| Contamination by | None | ||
| high intensity light | |||
SiC Silicon Carbide Wafer Features
1. High Thermal Conductivity: SiC wafers offer excellent heat dissipation, making them ideal for high-power and high-temperature applications. This property ensures that devices can operate efficiently without overheating.
2. Superior Electrical Performance: Silicon carbide has a wide bandgap, enabling SiC wafers to handle higher voltages and operate at higher frequencies than traditional silicon wafers. This enhances the performance of power devices like MOSFETs and diodes.
3. High Breakdown Voltage: SiC wafers exhibit a higher electric field breakdown strength compared to silicon, making them suitable for use in high-voltage and high-power electronics. This contributes to more reliable and robust electronic components.
4. Excellent Durability: SiC is highly resistant to wear, corrosion, and radiation, making SiC wafers durable and long-lasting even in harsh environments. This makes them a perfect choice for automotive, aerospace, and industrial applications.
5. Customizable for Various Applications: SiC wafers can be customized to meet specific requirements for different applications, offering flexibility in terms of size, thickness, and quality to suit the needs of customers in various industries.
Application Scenarios
Semiconductor silicon wafer is the upstream of integrated circuit industry and is an important material for manufacturing integrated circuits.
Semiconductor silicon wafer manufacturing technology is difficult, the downstream application is wide, the market value is high, is the main application field of silicon wafer. Silicon is the starting point of the semiconductor industry chain, through the front and back of the entire chip manufacturing process, without silicon semiconductor industry will be like water without a source. The output and quality of silicon wafers directly restricts the entire semiconductor industry, and the development of many industries such as communications, automobiles, and computers further downstream, and is a key material for manufacturing chips.
Semiconductor products are mainly used in computer, household appliances, digital electronics, electrical, communications, transportation, medical, aerospace and many other fields.
Packaging and Transportation
The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.
We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed.
We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection.
Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.
We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.
Enterprise Strength
Factory Area: 3000 sq
Process:
1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation
Capacity:
Glass Wafer --- 30K pcs
Silicon Wafer --- 20K pcs
(Equal to 6in)
Quality Assurance
Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.
Warranty period: In accordance with the contract requirements.
Quality system management：
●Organize production according to ISO9001 and other quality system standards.
Quality management system and measures:
●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.
●Strengthen the quality inspection system, strengthen the process quality control
●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.
●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.
Quality control in the production stage:
●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.
●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.
●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.
Pre-sales and After-sales
Pre-sales Service
Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.
On-purchase Service
Produce products according to the confirmed specifications and our process.
After Sale Service
We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.
Plutosemi Co., Ltd. was established in 2019, headquartered in Nanhai, Foshan, focusing on the research and development, production, and sales of high-performance semiconductor materials.
Advanced production capacity: We have three major production bases in China, with a monthly production capacity of 100000 equivalent 6-inch silicon wafers and 30000 equivalent 8-inch glass wafers, ensuring stable and efficient product supply for our customers.
High quality products: We provide efficient and stable product supply innovative solutions in the fields of glass wafers, silicon polishing wafers, epitaxial wafers (EPI), silicon on insulator wafers (SOI), and more. Our silicon wafers have the characteristics of ultra-thin, ultraflat, and high-precision, which can meet the needs of various high-end applications. Our glass and quartz substrates are also renowned for their high smoothness and precise aperture design.
