D263t Glass Wafer
Glass Wafer
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+86-17701852595 WhatsApp
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sales@plutosemitech.com Email
The D263t Glass Wafer is a high-quality, versatile product designed for advanced semiconductor and microelectronics applications. Manufactured by SCHOTT, this wafer is available in various sizes, including 2-inch, 4-inch, 6-inch, 8-inch, and 12-inch, with customized sizes available upon request. The base material is high-purity SiO2, ensuring excellent optical clarity and minimal defects. The wafer is produced using the Down-Draw growth method, which enhances its uniformity and consistency. It meets RoHS compliance standards and is processed in a hundred-class clean room to maintain the highest level of cleanliness. Available surface finishes include DSP, SSP, and DSL, offering flexibility for different application needs. The thickness can also be tailored to the customer’s specific requirements, making this glass wafer ideal for precise and reliable performance in cutting-edge technologies. As a leading China D263t glass wafer manufacturer, we specialize in providing premium-quality D263t glass wafers for various industries, including semiconductor fabrication, optoelectronics, and precision engineering.
D263t Glass Wafer Specifications
| Optical Property | |||
Refractiive Index (nd (λ587.6 nm)) | Abbe Numbe r(ve = (ne– 1) / (nF‘ – nC‘)) | Dispersion | Stress Photoelastic Coefficien (in (nm/cm)/MPa) |
| 1.5354 | 55 | 1.5300 | 34.7 |
| Thermal Property | |
| Item | Value |
| Coefficient of Linear Thermal Expansion α(20 - 300 °C) | 7.2x10-6 K-1 * |
| Specific Heat Capacity Cp(20 - 100 °C) | 0.8 kJ/(kg·K) |
| Transformation temperature in ℃ | 557 |
| Mechanical Property | |
| Item | Value |
| Density ρ (25 °C) | 2.4351 g/cm3 |
| Torsion Modulus G | 30 kN/mm2 |
| Poisson's ratio | 0.21 |
| Knoop Hardness HK0.1/2 | 470 |
| Vickers hardness HK0.2/25 | 510 |
| Electrical Property | ||
| Item | Value | |
| Dielectric Constant（εr） （25℃，1 MHz） | 6.7 | |
| Leakage Constant（tanδ） （25℃，1 MHz） | 61×10-4 | |
| Electric Volume Resistivity （Ω·cm alternate current 50 Hz） | 250℃ | 1.6*108 |
| 350℃ | 3.5*108 | |
| Thermal Property | |
| Item | Value |
| Coefficient of Linear Thermal Expansion α(20 - 300 °C) | 3.25 x 10-6 K-1 * |
| Specific Heat Capacity Cp(20 - 100 °C) | 0.83 kJ/(kg·K) |
| Thermal Conductivity λ (90 °C) | 1.2 W/(m·K) |
| Technical Specifications | |||||||
| Diameter | 2inch | 3inch | 4inch | 5inch | 6inch | 8inch | 12inch |
| Thickness (um) | Depends on Request | ||||||
| Material | AF32eco & AF35G | ||||||
| Grade/Brand | SCHOTT | ||||||
| Surface Finished | DSP、SSP、DSL | ||||||
| TTV (um) | ＜5 | ＜5 | ＜5 | ＜5 | ＜5 | ＜10 | ＜15 |
| Bow/Warp (um) | ＜20 | ＜20 | ＜30 | ＜30 | ＜30 | ＜40 | ＜60 |
| Ra (nm) | ＜1 | ||||||
| S/D (um) | 40/20 | ||||||
Special Indexes：
Ultra-flat glass wafer: TTV＜1um
Ultra-thin glass wafer: Thickness：0.1-0.3um
Ultra-smooth glass wafer: Ra≤0.2nm
D263t Glass Wafer Features
1. High-Quality Material (SiO2 Base): The D263t glass wafer is made from high-purity SiO2 (silicon dioxide), ensuring excellent optical clarity, minimal defects, and superior performance for demanding applications.
2. Versatile Size Range: Available in standard diameters including 2-inch, 3-inch, 4-inch, 5-inch, 6-inch, 8-inch, and 12-inch. Custom sizes are also available to meet specific customer requirements.
3. Customization Options: The wafer can be customized in terms of thickness and surface finish, including DSP (Double Side Polished), SSP (Single Side Polished), and DSL (Double Side Lapped), offering flexibility for various applications.
4. Down-Draw Growth Method: Manufactured using the Down-Draw growth method, which ensures excellent uniformity, high quality, and consistency across the entire wafer.
5. RoHS Compliant: Fully compliant with RoHS (Restriction of Hazardous Substances) standards, ensuring environmental safety and regulatory compliance.
Application Scenarios
Semiconductor silicon wafer is the upstream of integrated circuit industry and is an important material for manufacturing integrated circuits.
Semiconductor silicon wafer manufacturing technology is difficult, the downstream application is wide, the market value is high, is the main application field of silicon wafer. Silicon is the starting point of the semiconductor industry chain, through the front and back of the entire chip manufacturing process, without silicon semiconductor industry will be like water without a source. The output and quality of silicon wafers directly restricts the entire semiconductor industry, and the development of many industries such as communications, automobiles, and computers further downstream, and is a key material for manufacturing chips.
Semiconductor products are mainly used in computer, household appliances, digital electronics, electrical, communications, transportation, medical, aerospace and many other fields.
Packaging and Transportation
The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.
We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed.
We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection.
Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.
We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.
Enterprise Strength
Factory Area: 3000 sq
Process:
1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation
Capacity:
Glass Wafer --- 30K pcs
Silicon Wafer --- 20K pcs
(Equal to 6in)
Quality Assurance
Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.
Warranty period: In accordance with the contract requirements.
Quality system management：
●Organize production according to ISO9001 and other quality system standards.
Quality management system and measures:
●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.
●Strengthen the quality inspection system, strengthen the process quality control
●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.
●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.
Quality control in the production stage:
●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.
●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.
●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.
Pre-sales and After-sales
Pre-sales Service
Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.
On-purchase Service
Produce products according to the confirmed specifications and our process.
After Sale Service
We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.
Plutosemi Co., Ltd. was established in 2019, headquartered in Nanhai, Foshan, focusing on the research and development, production, and sales of high-performance semiconductor materials.
Advanced production capacity: We have three major production bases in China, with a monthly production capacity of 100000 equivalent 6-inch silicon wafers and 30000 equivalent 8-inch glass wafers, ensuring stable and efficient product supply for our customers.
High quality products: We provide efficient and stable product supply innovative solutions in the fields of glass wafers, silicon polishing wafers, epitaxial wafers (EPI), silicon on insulator wafers (SOI), and more. Our silicon wafers have the characteristics of ultra-thin, ultraflat, and high-precision, which can meet the needs of various high-end applications. Our glass and quartz substrates are also renowned for their high smoothness and precise aperture design.
