The Fused Silica JGS1 Glass Wafer is a high-performance material widely used in precision applications. Available in sizes ranging from 2 to 12 inches (custom sizes also available), it offers exceptional optical clarity and thermal stability. Made from high-purity SiO2, this wafer exhibits a low density of 2.2g/cm3 and a high melting point of 1730°C. It can safely withstand continuous operating temperatures of 1000-1100°C and short-term exposure to temperatures up to 1400°C. Its Moh's hardness rating of 7 ensures durability, while its resistance to rapid temperature changes (800-1100°C) makes it suitable for a variety of industrial applications. The wafer also boasts a thermal expansion coefficient of 5.4×10^-7 and a dielectric constant of 3.7 at normal temperatures, making it an ideal choice for electronics, semiconductor, and photonics industries. As a leading China JGS1 Glass Wafer supplier, we specialize in providing high-quality fused silica wafers with superior optical and thermal properties.

Product Name: Fused Silica JGS1 Glass Wafer

Size: 2/4/6/8/12inch or customized

Package: Hundred-class clean room

Customized Support: YES

RoHS: YES

Delivery Methods: Logistics Express

Marketable Area: oversea

Growth Method: Gas refining method/Synthesis

Base: SiO2

Density: 2.2g/cm3

Melting Point: 1730℃

Moh's Hardness: 7

Maximum safe operating temperature (continuous): 1000-1100℃

Maximum safe operating temperature (short time): 1300-1400℃

Resistance to rapid change in temperature: 800-1100℃

Thermal Expansion Coefficient: 5.4×10-7

Dislectric Constant(0~106 Hz): 3.7(Normal Temperatures)

Conductivity(S/m): 10-17~10-16(20℃)

Color: Transparent

1. High Purity Base Material (SiO2): Made from high-purity fused silica (SiO2), ensuring superior optical transparency and minimal impurities for precision applications.

2. Wide Size Range: Available in standard sizes of 2, 4, 6, 8, and 12 inches, with customization options to meet specific project requirements.

3. Exceptional Thermal Stability: With a melting point of 1730°C, the wafer is highly resistant to thermal stress, offering excellent performance in high-temperature environments.

4. Superior Temperature Resistance: Can withstand continuous operating temperatures of 1000-1100°C, and can tolerate short-term exposure up to 1300-1400°C without compromising structural integrity.

5. High Durability: The Moh’s hardness of 7 provides resistance to scratches and surface damage, ensuring the wafer's longevity in demanding applications.

Semiconductor silicon wafer is the upstream of integrated circuit industry and is an important material for manufacturing integrated circuits.

Semiconductor silicon wafer manufacturing technology is difficult, the downstream application is wide, the market value is high, is the main application field of silicon wafer. Silicon is the starting point of the semiconductor industry chain, through the front and back of the entire chip manufacturing process, without silicon semiconductor industry will be like water without a source. The output and quality of silicon wafers directly restricts the entire semiconductor industry, and the development of many industries such as communications, automobiles, and computers further downstream, and is a key material for manufacturing chips.

Semiconductor products are mainly used in computer, household appliances, digital electronics, electrical, communications, transportation, medical, aerospace and many other fields.

The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.

We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed. 

We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection. 

Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.

We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.

Factory Area: 3000 sq

Process:

1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation

Capacity:

Glass Wafer --- 30K pcs 

Silicon Wafer --- 20K pcs 

(Equal to 6in) 

Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.

Warranty period: In accordance with the contract requirements.

Quality system management：

●Organize production according to ISO9001 and other quality system standards.

Quality management system and measures:

●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.

●Strengthen the quality inspection system, strengthen the process quality control

●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.

●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.

Quality control in the production stage:

●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.

●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.

●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.

Pre-sales Service

Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.

On-purchase Service

Produce products according to the confirmed specifications and our process.

After Sale Service

We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.