sales@plutosemitech.com | WhatsApp:  +86-17701852595
HomeProducts Silicon Wafer Float Zone Wafer
Float Zone Wafer

Float Zone Wafer

Silicon Wafer

Float Zone ( also Floating Zone or FZ ) wafers are used primarily for applications in which very high resistivity or the absence of oxygen are necessary for good device performance.
PLUTOSEMI
Products Description

Float Zone Wafer is a high-purity silicon wafer prepared by the Float Zone Method. Floating zone method is an advanced crystal growth technique that locally melts polycrystalline silicon rods at high temperatures and uses surface tension to move the melted area along the rod body, thereby forming single crystal silicon. This process does not require the use of crucibles, avoiding impurity contamination, thus enabling the production of extremely high purity silicon materials. Float Zone Wafer has become an important foundational material for the semiconductor industry and high-tech fields due to its excellent purity and uniformity.


Float Zone Wafer

Float Zone Wafer

Float Zone Wafer Specifications

Diameter2", 3" , 4" , 5", 6", 8", 12"
GradePrime
Growth MethodFZ (Flow Zone)
Orientation< 1-0-0 > , < 1-1-1 > , < 1-1-0 >
Type/DopantIntrinsic, Undoped, P Type/Boron , N Type/Phos, NTD, Gas-Doped,
Resistivity> 5000Ω·cm, > 10000Ω·cm, > 20000Ω·cm
Life Time> 500us, > 1000us
OEM/ODMAccept
Compay NatureChina Manufacturers Suppliers Factory


Float Zone Wafer


Float Zone Wafer


Float Zone Wafer Features

1. Low defect concentration

Due to the avoidance of crucible contact and impurity introduction by the floating zone method, float zone silicon wafers have a lower concentration of crystal defects. This characteristic makes it perform well in high-precision electronic devices, especially in applications that require stability and consistency.


2. High resistivity range

The resistivity of float zone silicon wafers can reach over 10k ohm cm, much higher than that of ordinary silicon wafers. This high resistivity characteristic makes it very suitable for the manufacturing of high-power devices and precision detectors.


3. Excellent uniformity

Float Zone Wafer is known for its excellent resistivity uniformity, especially in the Neutron Transmutation Doped (NTD) silicon products, where the range of resistivity variation is extremely small, making it the lowest among any crystalline silicon products on the market.


4. Diversified specification selection

PLUTO offers a wide range of Float Zone Wafer diameters, up to 200mm, and supports multiple customized specifications to meet the needs of different customers.


5. Wide range of resistivity coverage

The resistivity range of NTD Float Zone silicon ranges from 5 Ω• cm to 4000 Ω• cm, covering almost all high-end application needs and providing customers with flexible choices.


6. Environmental Protection and Sustainability

The production process of Float Zone Wafer focuses on environmental protection and reduces its impact on the environment. Its high purity and performance also reduce resource waste, in line with the concept of modern green manufacturing.


Float Zone Wafer Process Flow

The production of float zone silicon wafers begins with the preparation of high-quality polycrystalline silicon rods. These raw materials have undergone strict screening to ensure their purity and consistency meet the requirements of the floating zone method. In the floating zone method, the polycrystalline silicon rod is locally heated to its melting point, forming a narrow melting zone. By slowly moving the molten region, silicon crystals will gradually grow into a single crystal structure. The unique feature of the floating zone method lies in its crucible free design, which avoids the contamination that may be caused by crucible materials in traditional direct drawing methods, thereby further improving the purity of silicon wafers. By adjusting the type and concentration of dopants, the resistivity of Float Zone Wafer can be precisely controlled to meet the needs of different application scenarios. The grown single crystal silicon rod is cut into thin slices and subjected to precision polishing treatment to obtain a smooth surface and precise thickness. Each Float Zone Wafer undergoes a rigorous testing process, including resistivity measurement, crystal structure analysis, and surface quality inspection, to ensure that the product meets high standards.

Float Zone Wafer Application

1. High power electronic devices

Float Zone Wafer is widely used in the manufacturing of high-power electronic devices, such as power amplifiers, rectifiers, and inverters, due to its high resistivity and low defect concentration.


2. Detectors and sensors

In the field of radiation detectors and high-sensitivity sensors, the high purity and uniformity of float zone silicon wafers make it an indispensable material, particularly suitable for medical imaging equipment and nuclear physics research.


3. Solar cells

Float Zone Wafer is also widely used in high-efficiency solar cells, and its high purity and low defect characteristics can significantly improve the photoelectric conversion efficiency.


4. Research and laboratory applications

Due to its excellent performance, Float Zone Wafer is often used in scientific research and laboratory testing, such as semiconductor material research and the development of new electronic devices.


5. Aerospace and Defense

In the aerospace and defense fields, Float Zone Wafer is used to manufacture high-performance radar systems, communication equipment, and navigation instruments, and its reliability is crucial.


6. Industrial automation

The control system and sensors in industrial automation equipment also rely on the high performance of Float Zone Wafer to ensure the accuracy and stability of equipment operation.


7. Communication technology

In the fields of optical and wireless communication, Float Zone Wafer is used to manufacture high-frequency signal processing chips and optoelectronic devices, improving data transmission speed and quality.


8. New energy technologies

With the development of new energy technologies, the application of Float Zone Wafer in electric vehicle battery management systems and smart grids is increasing, promoting the advancement of clean energy technology.


About Us PLUTOSEMI

Plutosemi Co., Ltd.  was established in 2019, headquartered in Nanhai, Foshan, focusing on the research and development, production, and sales of high-performance semiconductor materials. 

Advanced production capacity: We have three major production bases in China, with a monthly production capacity of 100000 equivalent 6-inch silicon wafers and 30000 equivalent 8-inch glass wafers, ensuring stable and efficient product supply for our customers.

High quality products: We provide efficient and stable product supply innovative solutions in the fields of glass wafers, silicon polishing wafers, epitaxial wafers (EPI), silicon on insulator wafers (SOI), and more. Our silicon wafers have the characteristics of ultra-thin, ultraflat, and high-precision, which can meet the needs of various high-end applications. Our glass and quartz substrates are also renowned for their high smoothness and precise aperture design.

Environment
PLUTOSEMI
PLUTOSEMI
PLUTOSEMI
PLUTOSEMI
PLUTOSEMI

PLUTOSEMI Popular Products

Request A Quote
This value is required!
This value is required!
This value is required!
This value is required! Minimum is 20 characters

Home

Products

Phone

About

Inquiry